Prime Minister Narendra Modi virtually laid the foundation stone for India Chip Private Limited, a joint venture between HCL Group and Foxconn, to set up an Outsourced Semiconductor Assembly & Test (OSAT) facility in YEIDA, Greater Noida.
The ā¹3,700-crore project, expected to be operational by 2028, will manufacture display driver chips with a planned capacity of 20,000 wafers per month. The facility is projected to generate over 3,500 jobs and strengthen Indiaās domestic semiconductor ecosystem.
The venture marks a major step in boosting self-reliance in semiconductor manufacturing, with both partners aiming to build a world-class, state-of-the-art facility in Uttar Pradesh.